Pasta Saldante Pasta in Stagno 100 gr PASTE Reballing BGA Flux QL-63/37A1

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Seller: global_import (12.711) 99.4%, Location: Villaricca, NA, Ships to: Europe, Item: 152761861436 Pasta Saldante Pasta in Stagno 100 gr PASTE Reballing BGA Flux QL-63/37A1 Grazie alla sua formula pastosa permette di essere dosato in giuste proporzioni a seconda del lavoro da svolgere. Passando con il saldatore la pasta si fonde in stagno di altissima qualità con percentuale di argento. Utilissimo nei lavori dove è necessaria la massima precisione come ad esempio sui pin di un componente o nella saldatura SMD. Il nostro Sn99Ag 0.3 Cu 0.7 ob-SP307 piombo pasta salda argento libera adotta la lega che è formata dal 99% di stagno, il 0,3% argento, e il 0,7% di rame. Questo prodotto è auspicabile per il processo di saldatura a riflusso che ha una domanda relativamente elevata. La sua temperatura di funzionamento può essere divisa in tre tipi. La temperatura di preriscaldo varia da 140 gradi Celsius a 190 gradi Celsius. La temperatura di fusione circa 250 gradi Celsius, e la temperatura di riflusso varia da 250 gradi Celsius a 240 gradi Celsius. Our Sn99Ag0.3Cu0.7 OB-SP307 lead free silver solder paste adopts the alloy which is formed by the 99% tin, the 0.3% silver, and the 0.7% copper. This product is desirable for the reflow soldering process which has relatively high demand. Its working temperature can be divided into three types. The preheat temperature varies from 140 degrees Celsius to 190 degrees Celsius. The melting temperature about 250 degrees Celsius, and the reflow temperature ranges from 250 degrees Celsius to 240 degrees Celsius. Specification of solder paste Sn63Pb37 Item Technical Indicator Using Standard alloy Sn63Pb37 / Particle Size 25-38um / Viscosity 190±30(10rpm/min) MalcomPCU-205 Metal Content 85~91wt%(±0.5) IPC-TM-6502.2.20 Flux Content 9~15wt%(±0.5) IPC-TM-6502.2.20 Solder Ball Test Qualified IPC-TM-6502.2.43 Humidity Test Qualified IPC-TM-6502.2.45 Collapse Test Qualified IPC-TM-6502.2.35 Halogen Content Qualified JIS-Z31976.5(1) Electromigration Qualified IPC-TM-6502.6.14.1 Bronze Mirror Corrosion Test Qualified IPC-TM-6502.3.32 Surface Insulation Impedance >1×10Ω IPC-TM-6502.6.3 Thixotropic Index 0.6±0.1 Inhouse solder paste Sn63Pb37 details: solder paste storage 1.Paste save allowable temperature 1-10 ℃, the optimum range of 5-10 ℃, the shelf life of six months (counting from the date of manufacture). 2. Prior to use, the solder paste previously removed from the refrigerator at least 4 hours at room temperature, which is to return to work in order to make the paste temperature, but also to prevent moisture condensation on the surface of the solder paste the use of the environment Paste the best use of the environment: temperature 25±3℃, humidity of 40 to 70%. Solde Paste mixing 1.To make the paste is completely mixed, after warmed Please stir paste. 2. Mixing machine generally 1 to 3 minutes, stirring artificial usually 3 to 5 minutes (the longer the paste storage time, stirring longer) solder paste Sn63Pb37 applicable objects: laptop ,computer,mobile phone,home Appliances for LED, SMT, SMD, PCB industry ect Condition: Nuovo, Marca: Mechanic, Tipo: Stagno in Pasta, Marca compatibile: Universale, MPN: SOLD.PAST.01, Composizione: Sn63/Pb37, Peso: 100gr

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